BS EN 60749-16:2003 - Semiconductor devices. Mechanical and climatic test methods. Particle impact noise detection (PIND)

BS EN 60749-16:2003

Semiconductor devices. Mechanical and climatic test methods. Particle impact noise detection (PIND)

Status : Current   Published : June 2003

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Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).




Standard NumberBS EN 60749-16:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Particle impact noise detection (PIND)
StatusCurrent
Publication Date19 June 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 60749-16:2003,EN 60749-16:2003
Amended ByAMD 15224
Corrigendum, June 2004
DescriptorsCeramics, Integrated circuits, Particulate materials, Vibration testing, Noise (spurious signals), Non-destructive testing, Wires, Semiconductor devices, Solders, Holes, Mechanical testing, Acoustic measurement, Environmental testing, Electronic equipment and components, Climate
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Detection de bruit d'impact de particules (PIND)
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Nachweis des Teilchen-Aufprallgeraeusches (PIND)
CommitteeEPL/47
ISBN0 580 42062 0
PublisherBSI
FormatA4
DeliveryYes
Pages10
File Size322 KB
Price£110.00


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