BS EN 61188-5-6:2003 - Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

BS EN 61188-5-6:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

Status : Current   Published : June 2003

Format
PDF

Format
HARDCOPY



Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.




Standard NumberBS EN 61188-5-6:2003
TitlePrinted boards and assemblies. Design and use. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides
StatusCurrent
Publication Date26 June 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60601-1-1:2001,EN 61188-5-6:2003,IEC 61188-5-6:2003
Draft Superseded By95/208510 DC
DescriptorsPrinted-circuit boards, Design, Electronic equipment and components, Soldering, Printed circuits, Dimensions, Integrated circuits, Dimensional tolerances
ICS31.190
Title in FrenchCartes imprimees et cartes imprimees equipees. Conception et utilisation. Considerations sur les liaisons pistes-soudures Composants sorties en J sur quatre cotes
Title in GermanLeiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussflaeche/Verbindung). Bauelemente mit J-foermigen Anschluessen auf vier Seiten
CommitteeEPL/501
ISBN0 580 42110 4
PublisherBSI
FormatA4
DeliveryYes
Pages22
File Size557.9 KB
Price£130.00


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