BS EN 60191-6-2:2002, IEC 60191-6-2:2001 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

BS EN 60191-6-2:2002, IEC 60191-6-2:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Status : Current   Published : March 2002

Format
PDF

Format
HARDCOPY



IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).




Standard NumberBS EN 60191-6-2:2002, IEC 60191-6-2:2001
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
StatusCurrent
Publication Date29 March 2002
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60191-6-2 (IEC 60191-2:2001,EN 60216-3 (IEC 60216-3:2002),IEC 60191-6-2:2001
Amended ByAmd 14243 (Corr to BS EN 60191-6-2:2002)
Corrigendum, March 2003
DescriptorsSemiconductor devices, Dimensions, Design, Engineering drawings, Electronic equipment and components, Drawings, Standardization, Integrated circuits, Surface mounting devices
ICS01.100.25
31.080.01
Title in FrenchNormalisation mecanique des disposifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs pour montage en surface. Guide de conception pour les boitiers a broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Gehaeuse mit Kugel- und Saeulenanschluessen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm
CommitteeEPL/47
ISBN0 580 39260 0
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size406.7 KB
Price£110.00


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