| Standard Number | BS EN 60191-6-2:2002, IEC 60191-6-2:2001 |
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| Title | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
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| Status | Current |
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| Publication Date | 29 March 2002 |
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| Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
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| Informative References(Provided for Information) | No other standards are informatively referenced |
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| International Relationships | EN 60191-6-2 (IEC 60191-2:2001,EN 60216-3 (IEC 60216-3:2002),IEC 60191-6-2:2001 |
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| Amended By | Amd 14243 (Corr to BS EN 60191-6-2:2002)
Corrigendum, March 2003 |
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| Descriptors | Semiconductor devices, Dimensions, Design, Engineering drawings, Electronic equipment and components, Drawings, Standardization, Integrated circuits, Surface mounting devices |
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| ICS | 01.100.25
31.080.01
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| Title in French | Normalisation mecanique des disposifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs pour montage en surface. Guide de conception pour les boitiers a broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm |
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| Title in German | Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Gehaeuse mit Kugel- und Saeulenanschluessen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm |
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| Committee | EPL/47 |
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| ISBN | 0 580 39260 0 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 14 |
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| File Size | 406 KB |
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| Price | £112.00 |
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