BS EN 61192-3:2003 - Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies
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BS EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies

Status : Withdrawn   Published : April 2003

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Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.




Standard NumberBS EN 61192-3:2003
TitleWorkmanship requirements for soldered electronic assemblies. Through-hole mount assemblies
StatusWithdrawn
Publication Date07 April 2003
Withdrawn Date08 May 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61192-3 (IEC 61192-3:2002),IEC 61192-3:2002
Draft Superseded By98/232815 DC
DescriptorsAssessed quality, Printed circuits, Assembling, Soldering, Electronic equipment and components, Laminates, Printed-circuit boards
ICS31.190
Title in FrenchExigences relatives a la qualite d'execution des assemblages electroniques brases. Assemblage au moyen de trous transversants
Title in GermanAnforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Durchsteckmontage
CommitteeEPL/501
ISBN0 580 41544 9
PublisherBSI
FormatA4
DeliveryYes
Pages50
File Size5.626 MB
NotesThe corresponding IEC and EN standards have been withdrawn
Price£246.00


WITHDRAWN TITLE
*To ask about withdrawn titles contact the
Customer Relations
cservices@bsigroup.com, +44 345 086 9001
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