BS EN 60191-6-10:2003 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON

BS EN 60191-6-10:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON

Status : Current   Published : March 2004

Format
PDF

Format
HARDCOPY



IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).




Standard NumberBS EN 60191-6-10:2003
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON
StatusCurrent
Publication Date31 March 2004
Normative References(Required to achieve compliance to this standard)ISO/DIS 2692, IEC 60191, EN 60191
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60191-6-10:2003,IEC 60191-6-10:2003
Draft Superseded By01/201170 DC
DescriptorsSurface mounting devices, Engineering drawings, Standardization, Drawings, Electronic equipment and components, Dimensions, Semiconductor devices, Integrated circuits
ICS31.080.01
Title in FrenchNormalisation mecanique des dispositifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs pour montage en surface. Dimensions des boitiers P-VSON
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. P-VSON Gehaeusemasse
CommitteeEPL/47
ISBN0 580 43613 6
PublisherBSI
FormatA4
DeliveryYes
Pages16
File Size575 KB
Price£130.00


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