BS EN 60749-3:2002 - Semiconductor devices. Mechanical and climatic test methods. External visual examination

BS EN 60749-3:2002

Semiconductor devices. Mechanical and climatic test methods. External visual examination

Status : Superseded, Withdrawn   Published : August 2002 Replaced By : BS EN 60749-3:2017

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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.




Standard NumberBS EN 60749-3:2002
TitleSemiconductor devices. Mechanical and climatic test methods. External visual examination
StatusSuperseded, Withdrawn
Publication Date27 August 2002
Withdrawn Date24 November 2017
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 60749-3:2017
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 60749-3:2002,EN 60749-3:2002
Amended ByAMD 14110
Corrigendum, September 2002
DescriptorsIntegrated circuits, Non-destructive testing, Visual inspection (testing), Electronic equipment and components, Environmental testing, Mechanical testing, External, Climate, Semiconductor devices
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Examen visuel externe
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Aeussere Sichtpruefung
CommitteeEPL/47
ISBN0 580 40295 9
PublisherBSI
FormatA4
DeliveryYes
Pages8
File Size336 KB
Price£110.00


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