BS EN 62258-2:2005 - Semiconductor die products. Exchange data formats

BS EN 62258-2:2005

Semiconductor die products. Exchange data formats

Status : Revised, Withdrawn   Published : October 2005 Replaced By : BS EN 62258-2:2011

WITHDRAWN TITLE
*To ask about withdrawn titles contact the
BSI Customer Services
cservices@bsigroup.com, +44 345 086 9001


IEC 62258-2:2005 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the IEC 62258 series as well as definitions of all parameters used according to the principles and methods of IEC 61360-1, IEC 61360-2 and IEC 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.




Standard NumberBS EN 62258-2:2005
TitleSemiconductor die products. Exchange data formats
StatusRevised, Withdrawn
Publication Date17 October 2005
Withdrawn Date31 July 2011
Normative References(Required to achieve compliance to this standard)IEC 61360-2:2002, ISO 8601:2004, ISO 10303-21:2002, IEC 61360-1:2002, IEC 62258-1, EN 62258-1, EN 61360-4:1997, EN 61360-2:2002, ISO 6093:1985, EN 61360-1:2002, IEC 61360-4:1997
Informative References(Provided for Information)ES 59008-6-1:1999
Replaced ByBS EN 62258-2:2011
ReplacesPD ES 59008-6-1:1999
International RelationshipsEN 62258-2 (IEC 62258-2:2005),IEC 62258-2:2005
Draft Superseded By02/207675 DC
DescriptorsData transfer, Information exchange, Integrated circuits, Semiconductors, Electronic equipment and components, Data layout, Standardized parameters, Databases, Dictionaries, Data representation, Data, Data blocks, Data syntax
ICS31.080.99
Title in FrenchProduits de matrice de semi-conducteur. Formats de donnees d'echange
Title in GermanHalbleiter-Chip-Erzeugnisse. Datenaustausch-Formate
CommitteeEPL/47
ISBN0 580 46504 7
PublisherBSI
FormatA4
DeliveryNo
Pages70
File Size719 KB
Price£254.00


WITHDRAWN TITLE
*To ask about withdrawn titles contact the
BSI Customer Services
cservices@bsigroup.com, +44 345 086 9001
 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


BSOL

The faster, easier way to work with standards


Worldwide Standards
We can source any standard from anywhere in the world


Develop a PAS

Develop a fast-track standardization document in 9-12 months