BS EN 60749-31:2003 - Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (internally induced)

BS EN 60749-31:2003

Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (internally induced)

Status : Current   Published : July 2003

Format
PDF

Format
HARDCOPY



Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.




Standard NumberBS EN 60749-31:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (internally induced)
StatusCurrent
Publication Date04 July 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 60749-31:2002,IEC 61073-1:2009,EN 60749-31:2003
DescriptorsEncapsulated, Semiconductor devices, Environmental testing, Electrical testing, Climate, Electronic equipment and components, Plastics, Flammability, Integrated circuits, Fire tests, Mechanical testing
ICS31.080.01
33.180.20
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Inflammabilite des dispositifs a encapsulation plastique (cas d'une cause interne d'inflammation)
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Entflammbarkeit von Bauelementen in Kunststoffgehaeusen (Selbstentzuendung)
CommitteeEPL/47
ISBN0 580 42200 3
PublisherBSI
FormatA4
DeliveryYes
Pages8
File Size309 KB
Price£110.00


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