BS EN 60749-22:2003 - Semiconductor devices. Mechanical and climatic test methods. Bond strength

BS EN 60749-22:2003

Semiconductor devices. Mechanical and climatic test methods. Bond strength

Status : Current   Published : July 2003

Format
PDF

Format
HARDCOPY



Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.




Standard NumberBS EN 60749-22:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Bond strength
StatusCurrent
Publication Date04 July 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 62317-9:2006/AMD1:2007,IEC 60749-22:2002,EN 60749-22:2003
DescriptorsClimate, Bonding, Electronic equipment and components, Environmental testing, Mechanical testing, Integrated circuits, Strength of materials, Semiconductor devices
ICS29.100.10
31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Robustesse des contacts soudes
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Kontaktfestigkeit (Bond strength)
CommitteeEPL/47
ISBN0 580 42199 6
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size829 KB
Price£182.00


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