BS EN 60749-20:2003 - Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

BS EN 60749-20:2003

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Status : Revised, Withdrawn   Published : July 2003 Replaced By : BS EN 60749-20:2009

WITHDRAWN TITLE
*To ask about withdrawn titles contact the
BSI Customer Services
cservices@bsigroup.com, +44 345 086 9001


Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.




Standard NumberBS EN 60749-20:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
StatusRevised, Withdrawn
Publication Date07 July 2003
Withdrawn Date31 January 2010
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 60749-20:2009
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 60749-20:2002,EN 60749-20:2003
DescriptorsEncapsulated, Electronic equipment and components, Thermal testing, Environmental testing, Damp-heat tests, Solderability testing, Integrated circuits, Mechanical testing, Plastics, Climate, Surface mounting devices, Soldering, Semiconductor devices
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Resistance des CMS a boitier plastique a l'effet combine de l'humidite et de la chaleur de soudage
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Bestaendigkeit kunststoffverkappter oberflaechenmontierbarer Bauelemente (SMD) gegenueber der kombinierten Beanspruchung von Feuchte und Loetwaerme
CommitteeEPL/47
ISBN0 580 42197 X
PublisherBSI
FormatA4
DeliveryNo
Pages28
File Size492 KB
Price£182.00


WITHDRAWN TITLE
*To ask about withdrawn titles contact the
BSI Customer Services
cservices@bsigroup.com, +44 345 086 9001
 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


BSOL

The faster, easier way to work with standards


Worldwide Standards
We can source any standard from anywhere in the world


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version