BS EN 60749-8:2003 - Semiconductor devices. Mechanical and climatic test methods. Sealing
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BS EN 60749-8:2003

Semiconductor devices. Mechanical and climatic test methods. Sealing

Status : Current   Published : July 2003



Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Standard NumberBS EN 60749-8:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Sealing
Publication Date03 July 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsEN 60749-8:2003,IEC 60749-8:2002,IEC 60749-8:2002/COR1:2003
DescriptorsClimate, Leak tests, Integrated circuits, Semiconductor devices, Environmental testing, Electronic equipment and components, Mechanical testing, Seals
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Etancheite
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Dichtheit
ISBN0 580 42201 1
File Size462 KB

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