BS EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)

BS EN 61189-3:2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)

Status : Current   Published : March 2008

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IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:


- 6 V: Visual test methods: 3V01, 3V02 and 3V03;


- 7 D: Dimensional test methods: 3D03;


- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;


- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;


- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;


- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;


- 12 X: Miscellaneous test methods: 3X01.




Standard NumberBS EN 61189-3:2008
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)
StatusCurrent
Publication Date31 March 2008
Normative References(Required to achieve compliance to this standard)IEC 61189-1:1997, EN ISO 9002:1994, IEC 60695-11-5, IEC 61190-1-1, EN 60695-11-5:2005, EN 60584-1:1995, IEC 61190-1-2, IEC 60169-15, EN 60051, IEC 60068-2-78, IEC 61188-1-2:1998, IEC 62326-4-1:1996, ISO 9002:1994, IEC 60068-1:1988, IEC 60454-1:1992, IEC 62326-4:1996, IEC 60068-2-20:1979, ISO 9453:2006, EN 62326-4:1997, EN 60068-1:1994, EN 61189-1:1997, EN 61190-1-1:2002, EN 61190-1-2:2007, EN 60068-2-78:2001, EN ISO 9453:2006, IEC 60454-3-1:1998, EN 60454-3-1:1998, IEC 60051, EN 61188-1-2:1998, ISO 4046:1978, IEC 60068-2-20:1979/AMD 2:1987, HD 323.2.20 S3:1988, EN 62326-4-1:1997, EN 60454-1:1994, IEC 60584-1
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 61189-3:1997, IEC 61189-3:1997
International RelationshipsEN 60901:1996/A2:2000,EN 61189-3:2008,IEC 61189-3:2007
Draft Superseded By02/206623 DC
DescriptorsThermal testing, Reports, Visual inspection (testing), Solderability testing, Printed circuits, Electrical insulating materials, Dimensional measurement, Electrical testing, Precision, Accuracy, Peeling tests, Electronic equipment and components, Environmental testing, Printed-circuit boards, Mechanical testing, Fire tests
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai des structures d'interconnexion (cartes imprimées)
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
CommitteeEPL/501
ISBN978 0 580 61279 4
PublisherBSI
FormatA4
DeliveryYes
Pages122
File Size4.6 MB
Price£314.00


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