BS EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures

BS EN 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures

Status : Current   Published : November 2006

Format
PDF

Format
HARDCOPY



Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.




Standard NumberBS EN 61189-2:2006
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures
StatusCurrent
Publication Date30 November 2006
Normative References(Required to achieve compliance to this standard)ISO 9001:2000, IEC 60243-1:1998, IEC 61189-3:1997, IEC 60068-1:1988, ISO 3274:1996, EN 60068-2-2:1993, EN 61189-3:1997, IEC 60068-2-2:1974, IEC 60068-2-78:2001, HD 429 S1:1983, ANSI/UL-94:1993, EN ISO 3274:1997, EN 60068-2-78:2001, EN 60068-1:1994, EN ISO 9001:2000, EN 60243-1:1998, IEC 60093:1980
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 61189-2:1997, IEC 61189-2:1997
International RelationshipsEN 61189-2:2006,IEC 61189-2:2006,EN 60068-2-21 (IEC 60068-2-21:
Draft Superseded By02/206624 DC
DescriptorsElectrical insulating materials, High-temperature testing, Electronic equipment and components, Printed circuits, Electrodes, Testing conditions, Test specimens, Chemical analysis and testing, Volatile matter determination, Determination of content, Electric arcs, Gelation, Thermal testing, Electrical resistivity, Chemical-resistance tests, Flow measurement, Position, Cleaning, Sodium hydroxide, Resistance measurement, Accuracy, Thermal-shock tests, Impregnated materials, Plastics, Printed-circuit boards, Test equipment, Peeling tests, Time, Pull-out tests, Compressible flow, Electrical testing, Precision, Blistering
ICS31.180
45.060.01
Title in FrenchMethodes d'essais pour les materiaux electriques, les cartes imprimees et autres structures d'interconnexion et ensembles. Methodes d'essai des materiaux pour structures d'interconnexion
Title in GermanPruefverfahren fuer Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Pruefverfahren fuer Materialien fuer Verbindungsstrukturen
CommitteeEPL/501
ISBN0 580 49650 3
PublisherBSI
FormatA4
DeliveryYes
Pages128
File Size2.17 MB
Price£314.00


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