| Standard Number | BS EN 60749-14:2003 |
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| Title | Semiconductor devices. Mechanical and climatic test methods. Robustness of terminations (lead integrity) |
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| Status | Current, Under review |
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| Publication Date | 15 December 2003 |
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| Normative References(Required to achieve compliance to this standard) | EN 60749-8:2003, IEC 60749-8 |
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| Informative References(Provided for Information) | No other standards are informatively referenced |
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| Replaces | BS EN 60749:1999, IEC 60749:1996 |
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| International Relationships | EN 60068-2-13:1999,EN 60749-14 (IEC 60749-14:2003,IEC 60749-14:2003 |
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| Draft Superseded By | 02/204667 DC |
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| Descriptors | Integrated circuits, Semiconductors, Climate, Environmental testing, Bend testing, Defects, Interfaces, Tensile testing, Destructive testing, Fatigue testing, Mechanical testing, Electronic equipment and components, Qualification approval, Torque, Semiconductor devices, Testing conditions |
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| ICS | 31.080.01
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| Title in French | Dispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Robustesse des sorties (integrite des connexions) |
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| Title in German | Halbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Festigkeit der Bauelementeanschluesse (Unversehrtheit der Anschluesse) |
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| Committee | EPL/47 |
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| ISBN | 0 580 43082 0 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 18 |
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| File Size | 724 KB |
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| Price | £134.00 |
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