DD IEC/TS 61967-3:2005 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz. Measurement of radiated emissions. Surface scan method

DD IEC/TS 61967-3:2005

Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz. Measurement of radiated emissions. Surface scan method

Status : Superseded, Withdrawn   Published : January 2006 Replaced By : PD IEC/TS 61967-3:2014

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This part of IEC 61967 provides a test procedure which defines a method for evaluating the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scanning probe. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This technique is capable of providing a detailed pattern of the radio frequency (RF) sources internal to the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe positioner. This method is intended for use over the 10 MHz to 1 GHz frequency range. Extended upper frequency limits are possible with existing probe technology but are beyond the scope of this specification. The probe is mechanically scanned according to a programmed pattern in a parallel or perpendicular plane to the IC surface. The data is computer processed to provide a colour- enhanced representation of the field strength at the scan frequency.




Standard NumberDD IEC/TS 61967-3:2005
TitleIntegrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz. Measurement of radiated emissions. Surface scan method
StatusSuperseded, Withdrawn
Publication Date09 January 2006
Withdrawn Date30 September 2014
Normative References(Required to achieve compliance to this standard)IEC 60050-131:2002, IEC 60050-161:1990, IEC 61967-1, IEC 61967-6
Informative References(Provided for Information)CISPR 16-1-1:2003, CISPR 16-1-2:2003, CISPR 16-1-3:2004, CISPR 16-1-4:2003, CISPR 16-1-5:2003, CISPR 16-2-1:2003, CISPR 16-2-2:2003, CISPR 16-2-3:2003, CISPR 16-2-4:2003
Replaced ByPD IEC/TS 61967-3:2014
International RelationshipsIEC/TS 61967-3:2005
Draft Superseded By03/112147 DC
DescriptorsIntegrated circuits, Electronic equipment and components, Emission, Electromagnetic radiation, Electromagnetic fields, Surfaces, Scanners, Radiofrequencies, Circuits, Radio disturbances, Noise (spurious signals), Electrical testing, Electrical measurement, Probes
ICS31.200
Title in FrenchCircuits integres. Mesure des emissions electromagnetiques, 150 kHz a 1 GHz. Mesure des emissions rayonnees. Methode de scrutation surfacique
Title in GermanIntegrierte Schaltungen. Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz. Messung der abgestrahlten Aussendungen. Verfahren der Oberflaechenabtastung
CommitteeEPL/47
ISBN0 580 46493 8
PublisherBSI
FormatA4
DeliveryNo
Pages28
File Size1.252 MB
Price£182.00


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