| Standard Number | BS EN 60191-6-4:2003 |
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| Title | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) |
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| Status | Current |
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| Publication Date | 04 August 2003 |
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| Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
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| Informative References(Provided for Information) | No other standards are informatively referenced |
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| International Relationships | EN 60191-6-4 (IEC 60191-6-4:20,IEC 60191-6-4:2003 |
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| Draft Superseded By | 01/207685 DC |
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| Descriptors | Surface mounting devices, Standardization, Integrated circuits, Electronic equipment and components, Semiconductor technology, Semiconductor devices, Dimensions, Drawings, Engineering drawings |
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| ICS | 31.080.01
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| Title in French | Normalisation mecanique des dispositifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface. Methodes de mesure pour les dimensions des boitiers matriciels a billes |
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| Title in German | Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Messverfahren fuer Gehaeusemasse von Ball Grid Array (BGA) |
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| Committee | EPL/47 |
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| ISBN | 0 580 42356 5 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 20 |
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| File Size | 429 KB |
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| Price | £130.00 |
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