Standard Number | BS EN 60191-6-4:2003 |
Title | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) |
Status | Current |
Publication Date | 04 August 2003 |
Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
Informative References(Provided for Information) | No other standards are informatively referenced |
International Relationships | EN 60191-6-4 (IEC 60191-6-4:20,IEC 60191-6-4:2003 |
Draft Superseded By | 01/207685 DC |
Descriptors | Surface mounting devices, Standardization, Integrated circuits, Electronic equipment and components, Semiconductor technology, Semiconductor devices, Dimensions, Drawings, Engineering drawings |
ICS | 31.080.01
|
Title in French | Normalisation mecanique des dispositifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface. Methodes de mesure pour les dimensions des boitiers matriciels a billes |
Title in German | Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Messverfahren fuer Gehaeusemasse von Ball Grid Array (BGA) |
Committee | EPL/47 |
ISBN | 0 580 42356 5 |
Publisher | BSI |
Format | A4 |
Delivery | Yes |
Pages | 20 |
File Size | 808 KB |
Price | £134.00 |