BS EN 60749:1999, IEC 60749:1996 - Semiconductor devices. Mechanical and climatic test methods

BS EN 60749:1999, IEC 60749:1996

Semiconductor devices. Mechanical and climatic test methods

Status : Revised, Superseded, Withdrawn   Published : April 1999 Replaced By : BS EN 60749-5:2003, BS EN 60749-21:2005, BS EN 60749-15:2003, BS EN 60749-1:2003, BS EN 60749-36:2003, BS EN 60749-6:2002, BS EN 60749-2:2002, BS EN 60749-4:2002, BS EN 60749-9:2002, BS EN 60749-8:2003, BS EN 60749-12:2002, BS EN 60749-14:2003, BS EN 60749-25:2003, BS EN 60749-20:2003, BS EN 60749-22:2003, BS EN 60749-31:2003, BS EN 60749-13:2002, BS EN 60749-10:2002, BS EN 60749-7:2002, BS EN 60749-3:2002, BS EN 60749-11:2002, BS EN 60749-39:2006, BS EN 60749-26:2006, BS EN 60749-19:2003+A1:2010, BS EN 60749-32:2003+A1:2010, BS EN 60749-27:2006+A1:2012

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Uniform preferred test methods and values for stress levels for judging the environmental properties of semiconductor devices (discrete and integrated circuits) from which a selection may be made.




Standard NumberBS EN 60749:1999, IEC 60749:1996
TitleSemiconductor devices. Mechanical and climatic test methods
StatusRevised, Superseded, Withdrawn
Publication Date15 April 1999
Withdrawn Date01 May 2007
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 60749-5:2003, BS EN 60749-21:2005, BS EN 60749-15:2003, BS EN 60749-1:2003, BS EN 60749-36:2003, BS EN 60749-6:2002, BS EN 60749-2:2002, BS EN 60749-4:2002, BS EN 60749-9:2002, BS EN 60749-8:2003, BS EN 60749-12:2002, BS EN 60749-14:2003, BS EN 60749-25:2003, BS EN 60749-20:2003, BS EN 60749-22:2003, BS EN 60749-31:2003, BS EN 60749-13:2002, BS EN 60749-10:2002, BS EN 60749-7:2002, BS EN 60749-3:2002, BS EN 60749-11:2002, BS EN 60749-39:2006, BS EN 60749-26:2006, BS EN 60749-19:2003+A1:2010, BS EN 60749-32:2003+A1:2010, BS EN 60749-27:2006+A1:2012
ReplacesBS 6493-3:1985, IEC 60749:1984
International RelationshipsEN 60749/A2 (IEC 60749/A2:2001,IEC 60749:1996/AMD2:2001
Amended ByAMD 13129
Amendment, September 2002
DescriptorsDefects, Endurance testing, Test equipment, Test specimens, Electric terminals, Temperature measurement, Environmental testing, Marking, Shear testing, Leak tests, Electronic equipment and components, Bonding, Stress, Moisture measurement, Vibration testing, Radioactive tracer methods, Thermal testing, Semiconductor devices, Fire tests, Damp-heat tests, Flammability, Testing conditions, Integrated circuits, Solderability testing, Strength of materials, Dimensional measurement, Classification systems, Specimen preparation, Accelerated testing, Pull-out tests, Mass spectrometry, Mechanical testing, Thermal-shock tests, Storage, Electrical testing, Visual inspection (testing), Torsion testing, Low-pressure tests
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Essais mecaniques et climatiques
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren
CommitteeEPL/47
ISBN0 580 32151 7
PublisherBSI
FormatA4
DeliveryNo
Pages80
File Size777 KB
NotesThis standard has been withdrawn as it has been replaced by various parts of the new series of BS EN 60749 standards.
Price£274.00


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