BS EN 62258-1:2005 - Semiconductor die products. Requirements for procurement and use

BS EN 62258-1:2005

Semiconductor die products. Requirements for procurement and use

Status : Revised, Withdrawn   Published : March 2006 Replaced By : BS EN 62258-1:2010

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This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.




Standard NumberBS EN 62258-1:2005
TitleSemiconductor die products. Requirements for procurement and use
StatusRevised, Withdrawn
Publication Date07 March 2006
Withdrawn Date30 November 2010
Normative References(Required to achieve compliance to this standard)ISO 14644-1:1999, EN 60191-4:1999, EN ISO 14644-1:1999, IEC 60191-4:1999/AMD 2:2002, EN 60191-4:1999/A2:2002, IEC 61360-1:2002, IEC 62258-2:2005, EN 60191-4:1999/A1:2002, EN 62258-2:2005, EN 61360-1:2002, IEC 60191-4:1999, IEC 60191-4:1999/AMD 1:2001
Informative References(Provided for Information)EIA/JEDEC JESD49, MIL-PRF-38534, EIA/JEDECD JESD16, MIL-PRF-19500, FED-STD-209, IEC 60749-26:2003, EIA/JEDEC JEP95, ES 59008-6-1, IPC/EIA J-STD-028, EIAJ EDR-4703, MIL-STD-883, EN 100015-1, ENV ISO 10303, ES 59008-6-2, IEC 60068-2, ES 59008, ANSI/EIA 557, IEEE 1076 VHSIC, IEEE 1029.1, EIAJ EDR-4701B, EIA/JEDEC JESD46, EN 61340-5-2:2001, IEC 61340-5-1:1998, EN ISO 9000:2000, IEC 60749-27:2003, JEDEC standard J-STD-012, EN 60068-2, EN 61340-5-1:2001, EN 28879:1990, ISO/IEC 11179-3:2003, ANSI/EIA 599, IPC/EIA J-STD-026, CENELEC HD 639 S1:2002, ISO 9000, ANSI/EIA 554, ISO 10303, IEC 61540:1997, ISO 8879:1986, IEC 61340-5-2:1999
Replaced ByBS EN 62258-1:2010
ReplacesPD ES 59008-3:1999, PD ES 59008-2:1999, PD ES 59008-1:2000, ES 59008-1:1999
International RelationshipsEN 62258-1 (IEC 62258-1:2005),IEC 62258-1:2005
Draft Superseded By01/206130 DC
DescriptorsDesign, Terminology, Mechanical properties of materials, Dimensions, Semiconductors, Integrated circuits, Product information, Substrates (insulating), Data, Semiconductor devices, Electric connectors, Geometry, Electronic equipment and components, Purchasing
ICS31.080.99
Title in FrenchProduits de matrice de semi-conducteur. Exigences pour l'acquisition et l'utilisation
Title in GermanHalbleiter-Chip-Erzeugnisse. Anforderungen fuer Beschaffung und Anwendung
CommitteeEPL/47
ISBN0 580 47900 5
PublisherBSI
FormatA4
DeliveryNo
Pages42
File Size425 KB
Price£214.00


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