BS EN 61188-5-2:2003 - Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components

BS EN 61188-5-2:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components

Status : Current   Published : October 2003

Format
PDF

Format
HARDCOPY



Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.




Standard NumberBS EN 61188-5-2:2003
TitlePrinted boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components
StatusCurrent
Publication Date16 October 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61188-5-2 (IEC 61188-5-2:20,IEC 61188-5-2:2003
Draft Superseded By01/200692 DC
DescriptorsDesign, Printed-circuit boards, Printed circuits, Electronic equipment and components
ICS31.180
31.190
Title in FrenchCartes imprimees et cartes imprimees equipees. Conception et utilisation. Considerations sur les liaisons pistes-soudures. Composants discrets
Title in GermanLeiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussflaeche/Verbindung). Einzelbauelemente
CommitteeEPL/501
ISBN0 580 42760 9
PublisherBSI
FormatA4
DeliveryYes
Pages56
File Size756 KB
Price£254.00


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