BS EN 60191-6-3:2001, IEC 60191-6-3:2001 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

BS EN 60191-6-3:2001, IEC 60191-6-3:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

Status : Current   Published : May 2001

Format
PDF

Format
HARDCOPY






Standard NumberBS EN 60191-6-3:2001, IEC 60191-6-3:2001
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
StatusCurrent
Publication Date15 May 2001
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60191-6-3 (IEC 60191-6-3:20
DescriptorsIntegrated circuits, Engineering drawings, Standardization, Semiconductor devices, Electronic equipment and components, Packages, Dimensions, Flat (shape), Drawings, Surface mounting devices
ICS01.100.25
31.080.01
Title in FrenchNormalisation mecanique des dispositifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface. Methodes de mesure pour les boitiers plats quadrangulaires (QFP)
Title in GermanMechanische Normung von Halbleiterbauelemente. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitegehaeusen. Messverfahren fuer QFP-Gehaeusemasse
CommitteeEPL/47
ISBN0 580 37243 X
PublisherBSI
FormatA4
DeliveryYes
Pages20
File Size361 KB
Price£130.00


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