BS EN 60749-15:2003 - Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

BS EN 60749-15:2003

Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

Status : Revised, Withdrawn   Published : June 2003 Replaced By : BS EN 60749-15:2010

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Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.




Standard NumberBS EN 60749-15:2003
TitleSemiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
StatusRevised, Withdrawn
Publication Date19 June 2003
Withdrawn Date28 February 2011
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 60749-15:2010
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 60749-15:2003,EN 60749-15:2003
Draft Superseded By00/203279 DC
DescriptorsMechanical testing, Solderability testing, Climate, Slots, Destructive testing, Encapsulated, Electronic equipment and components, Holes, Integrated circuits, Semiconductor devices, Thermal testing, Soldering, Environmental testing
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Resistance a la temperature de soudage pour dispositifs par trous traversants
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Bestaendigkeit gegen Loettemperatur bei Bauelementen zur Durchsteckmontage
CommitteeEPL/47
ISBN0 580 42061 2
PublisherBSI
FormatA4
DeliveryNo
Pages10
File Size316 KB
Price£110.00


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