BS EN 61190-1-1:2002 - Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly

BS EN 61190-1-1:2002

Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Status : Current   Published : August 2002

Format
PDF

Format
HARDCOPY



Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.




Standard NumberBS EN 61190-1-1:2002
TitleAttachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly
StatusCurrent
Publication Date16 August 2002
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61190-1-1 (IEC 61190-1-1:20,IEC 61190-1-1:2002
Draft Superseded By98/231473 DC
DescriptorsSoldering, Soldering fluxes, Electrical connections, Quality control, Bonding, Electronic engineering, Quality assurance, Electronic equipment and components
ICS31.190
Title in FrenchMateriaux de fixation pour les assemblages electroniques. Exigences relatives aux flux de brasage pour les interconnexions de haute qualite dans les assemblages de composants electroniques
Title in GermanVerbindungsmaterialien fuer Baugruppen der Elektronik. Anforderungen an Weichloet- Flussmittel fuer hochwertige Verbindungen in der elektronikmontage
CommitteeEPL/501
ISBN0 580 40261 4
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size425 KB
Price£182.00


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