BS EN 61190-1-2:2002 - Attachment materials for electronic assembly. Requirements for solder pastes for high-quality interconnections in electronic assembly

BS EN 61190-1-2:2002

Attachment materials for electronic assembly. Requirements for solder pastes for high-quality interconnections in electronic assembly

Status : Revised, Withdrawn   Published : August 2002 Replaced By : BS EN 61190-1-2:2007

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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).




Standard NumberBS EN 61190-1-2:2002
TitleAttachment materials for electronic assembly. Requirements for solder pastes for high-quality interconnections in electronic assembly
StatusRevised, Withdrawn
Publication Date12 August 2002
Withdrawn Date31 July 2007
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 61190-1-2:2007
International RelationshipsEN 61190-1-2:2002,IEC 61190-1-2:2002
Draft Superseded By98/231474 DC
DescriptorsElectronic equipment and components, Soldering, Soldered connectors, Solders, Electronic engineering, Quality assurance, Bonding, Quality control, Electrical connections, Pastes, Classification systems
ICS31.190
Title in FrenchMateriaux de fixation pour les assemblages electroniques. Exigences relatives aux cremes de brasage pour les interconnexions de haute qualite dans les assemblages de composants electroniques
Title in GermanVerbindungsmaterialien fuer Baugruppen der Elektronik. Anforderungen an Lotpaste fuer hochwertige Verbindungen in der Elektronikmontage
CommitteeEPL/501
ISBN0 580 40233 9
PublisherBSI
FormatA4
DeliveryNo
Pages22
File Size999 KB
Price£130.00


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