BS EN 60191-6-8:2001, IEC 60191-6-8:2001 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

BS EN 60191-6-8:2001, IEC 60191-6-8:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

Status : Current, Under review   Published : November 2001

Format
PDF

Format
HARDCOPY



IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.




Standard NumberBS EN 60191-6-8:2001, IEC 60191-6-8:2001
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)
StatusCurrent, Under review
Publication Date16 November 2001
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60191-6-8:2001,IEC 60191-6-8:2001
Draft Superseded By99/203696 DC
DescriptorsDrawings, Integrated circuits, Glass, Dimensions, Standardization, Ceramics, Surface mounting devices, Engineering drawings, Sealed, Electronic equipment and components, Interchangeability, Semiconductor devices
ICS01.100.25
31.080.01
Title in FrenchNormalisation mecanique des dispositifs a semiconducteurs. Regles generales pour la preparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface. Guide de conception pour les boitiers plats quadrangulaires en ceramique, scellement verre
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Glas-Keramik-Quad-Flatpack (G-QFP)
CommitteeEPL/47
ISBN0 580 38677 5
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size402 KB
Price£110.00


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