BS EN 61192-1:2003 - Workmanship requirements for soldered electronic assemblies. General
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BS EN 61192-1:2003

Workmanship requirements for soldered electronic assemblies. General

Status : Withdrawn   Published : June 2003

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Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.




Standard NumberBS EN 61192-1:2003
TitleWorkmanship requirements for soldered electronic assemblies. General
StatusWithdrawn
Publication Date26 June 2003
Withdrawn Date08 May 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61192-1:2003,IEC 61192-1:2003
Draft Superseded By92/28085 DCWD/DC92/28085
DescriptorsSoldering, Assembling, Printed-circuit boards, Testing conditions, Quality control, Electronic equipment and components, Printed circuits, Assessed quality, Visual inspection (testing), Soldered joints
ICS31.190
Title in FrenchExigences relatives a la qualite d'execution des assemblages electroniques brases. Generalites
Title in GermanAnforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Allgemeines
CommitteeEPL/501
ISBN0 580 42112 0
PublisherBSI
FormatA4
DeliveryYes
Pages78
File Size1.211 MB
NotesThe corresponding IEC and EN standards have been withdrawn
Price£280.00


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