BS EN 61192-2:2003 - Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies

BS EN 61192-2:2003

Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies

Status : Withdrawn   Published : June 2003

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Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.




Standard NumberBS EN 61192-2:2003
TitleWorkmanship requirements for soldered electronic assemblies. Surface-mount assemblies
StatusWithdrawn
Publication Date25 June 2003
Withdrawn Date08 May 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61192-2 (IEC 61192-2:2003),IEC 61192-2:2003
Draft Superseded By98/232814 DC
DescriptorsPrinted-circuit boards, Electronic equipment and components, Laminates, Surface mounting devices, Assembling, Assessed quality, Soldering, Printed circuits
ICS31.190
Title in FrenchExigences relatives a la qualite d'execution des assemblages electroniques brases. Assemblage par montage en surface
Title in GermanAnforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Oberflaechenmontage
CommitteeEPL/501
ISBN0 580 42113 9
PublisherBSI
FormatA4
DeliveryYes
Pages68
File Size4.309 MB
NotesThe corresponding IEC and EN standards have been withdrawn
Price£254.00


WITHDRAWN TITLE
*To ask about withdrawn titles contact the
BSI Customer Services
cservices@bsigroup.com, +44 345 086 9001
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