IEC 60191-2X:1999 - IEC 60191-2-A22 Mechanical standardization of semiconductor devices. Dimensions. Plastic thin small outline package(P-TSOP II)7.62 body family

IEC 60191-2X:1999

IEC 60191-2-A22 Mechanical standardization of semiconductor devices. Dimensions. Plastic thin small outline package(P-TSOP II)7.62 body family

Status : Current   Published : September 1999

Format
PDF

Format
HARDCOPY






Standard NumberIEC 60191-2X:1999
TitleIEC 60191-2-A22 Mechanical standardization of semiconductor devices. Dimensions. Plastic thin small outline package(P-TSOP II)7.62 body family
StatusCurrent
Publication Date30 September 1999
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ICS31.080.01
31.200
CommitteeEPL/47
ISBN2-8318-4960-8
PublisherIEC
FormatA4
DeliveryYes
Pages38
File Size314 KB
Price£56.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


Worldwide Standards
We can source any standard from anywhere in the world


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version


Collaborate, Innovate, Accelerate.