BS EN 61249-3-4:1999, IEC 61249-3-4:1999 - Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyimide film. Adhesive coated flexible polyimide film

BS EN 61249-3-4:1999, IEC 61249-3-4:1999

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyimide film. Adhesive coated flexible polyimide film

Status : Current   Published : June 1999

Format
PDF

Format
HARDCOPY



This part of IEC 60079-29 gives guidance on, and recommended practice for, the selection, installation, safe use and maintenance of electrically operated group II apparatus intended for use in industrial and commercial safety applications for the detection and measurement of flammable gases complying with the requirements of IEC 60079-29-1.This first edition of IEC 60079-29-2 cancels and replaces the first edition of IEC 61779-6:1999 and constitutes a technical revision with many changes with respect to the previous edition.




Standard NumberBS EN 61249-3-4:1999, IEC 61249-3-4:1999
TitleMaterials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyimide film. Adhesive coated flexible polyimide film
StatusCurrent
Publication Date15 June 1999
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61249-3-4:1999,IEC 60079-29-2:2007
DescriptorsAcrylic resins, Materials specification, Flammability, Flexible cables, Reinforced materials, Dimensional changes, Adhesives, Designations, Coated materials, Electrical properties of materials, Dimensions, Printed-circuit bases, Thickness, Specification (approval), Printed circuits, Insulating coatings, Flow, Insulating films, Printed-circuit boards, Marking, Conversion, Polymers, Films (states of matter), Test specimens, Epoxy resins, Electrical insulating materials, Dimensional tolerances
ICS29.260.20
31.180
Title in FrenchMateriaux pour circuits imprimes et autres structures d'interconnexion. Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles). Film flexible de polyimide recouvert de colle
Title in GermanMaterialien fuer Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikation fuer unverstaerkte, kaschierte und unkaschierte Basismaterialien (fuer flexible Leiterplatten). Kleberbeschichtete flexible Polyimidfolien
CommitteeEPL/501
ISBN0 580 32530 X
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size360 KB
Price£130.00


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