PD ES 59008-3:1999 - Data requirements for semiconductor die. Mechanical, material and connectivity requirements

PD ES 59008-3:1999

Data requirements for semiconductor die. Mechanical, material and connectivity requirements

Status : Superseded, Withdrawn   Published : December 1999 Replaced By : BS EN 62258-1:2005

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Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.




Standard NumberPD ES 59008-3:1999
TitleData requirements for semiconductor die. Mechanical, material and connectivity requirements
StatusSuperseded, Withdrawn
Publication Date15 December 1999
Withdrawn Date07 March 2006
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 62258-1:2005
International RelationshipsES 59008-3:1999
DescriptorsSemiconductors, Electronic equipment and components, Data, Integrated circuits, Mechanical properties of materials, Electrical connections, Electrical components, Electronic engineering, Conformity, Information exchange, Instructions for use, Marking, Numerical designations, Ratings, Performance, Dimensions, Electric terminals, Position, Polymers, Electrical insulating materials, Printed-circuit bases, Printed-circuit boards
ICS31.080.01
Title in FrenchExigences de donnees pour pastilles semi-conductrices. Exigences mecaniques, materielles et de connectivite
CommitteeEPL/47
ISBN0 580 35759 7
PublisherBSI
FormatA4
DeliveryNo
Pages14
File Size298.1 KB
Price£110.00


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