BS EN 61189-2:1997, IEC 61189-2:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures

BS EN 61189-2:1997, IEC 61189-2:1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures

Status : Revised, Withdrawn   Published : September 1997 Replaced By : BS EN 61189-2:2006

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Standard NumberBS EN 61189-2:1997, IEC 61189-2:1997
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures
StatusRevised, Withdrawn
Publication Date15 September 1997
Withdrawn Date01 September 2009
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 61189-2:2006
International RelationshipsEN 61189-2:1997,IEC 61189-2:1997
Amended ByAMD 9879
AMD 11046, March 2001 (not available separately). AMD 9879 was published to correct the title.
Draft Superseded By95/208502 DC
DescriptorsPrinted circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Testing conditions, Chemical analysis and testing, Accuracy, Precision, Chemical-resistance tests, Sodium hydroxide, Test specimens, Impregnated materials, Gelation, Time, Plastics, Determination of content, Compressible flow, Flow measurement, Electrical testing, Electrical resistivity, Resistance measurement, Electric arcs, Test equipment, Volatile matter determination, Thermal testing, Thermal-shock tests, Blistering, Pull-out tests, Peeling tests, High-temperature testing, Cleaning, Position, Electrodes
ICS31.180
31.190
Title in FrenchMethodes d'essais pour les materiaux electriques, les structures d'interconnexion et les ensembles. Methodes d'essai des materiaux pour structures d'interconnexion
Title in GermanPruefverfahren fuer Elektromaterialien, Verbindungsstrukturen und Baugruppen. Pruefverfahren fuer Materialien fuer Verbindungsstrukturen
CommitteeEPL/501
ISBN0 580 27849 2
PublisherBSI
FormatA4
DeliveryNo
Pages88
File Size1.376 MB
Price£274.00


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