BS EN 61249-2-13:1999, IEC 61249-2-13:1999 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad. Cyanate ester non-woven aramid laminate of defined flammability copper-clad

BS EN 61249-2-13:1999, IEC 61249-2-13:1999

Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad. Cyanate ester non-woven aramid laminate of defined flammability copper-clad

Status : Current   Published : June 1999

Format
PDF

Format
HARDCOPY



Applies to electrical and/or electronic equipment that have a rated input current up to 16 A per phase. Aims to establish a reference for evaluating the immunity of electric and/or electronic equipment when subjected to positive and negative low amplitude voltage fluctuations. Only conducted phenomena are considered, including immunity tests for equipment connected to public and industrial power supply networks. Has the status of a Basic EMC publication.

This consolidated version consists of the first edition (1999) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.


Standard NumberBS EN 61249-2-13:1999, IEC 61249-2-13:1999
TitleMaterials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad. Cyanate ester non-woven aramid laminate of defined flammability copper-clad
StatusCurrent
Publication Date15 June 1999
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61249-2-13:1999,IEC 61249-2-13
Draft Superseded By95/208513 DC
DescriptorsDefects, Water absorption, Printed circuits, Esters (carboxylic), Cyanates, Printed-circuit boards, Sheet materials, Printed-circuit bases, Form tolerances, Laminates, Preferred sizes, Bend testing, Specification (approval), Electrical properties of materials, Approval testing, Strength of materials, Surface properties, Quality assurance, Packaging, Thickness, Pull-out tests, Reinforced materials, Thermal properties of materials, Stability, Dimensional tolerances, Acceptance (approval), Dimensions, Electrical insulating materials, Copper, Peeling tests, Coated materials, Flammability
ICS31.180
33.100.20
Title in FrenchMateriaux pour circuits imprimes et autres structures d'interconnexion. Collection de specifications intermediaires pour les materiaux de base renforces, recouverts ou non de feuille conductrice. Stratifie a base d'aramide non tisse colle avec de la resine cyanate ester, recouvert de cuivre, d'inflammabilite definie
Title in GermanMaterialien fuer Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikation fuer verstaerkte, kaschierte und unkaschierte. Basismaterialien Aramidwirrfaser-verstaerktes Cyanatester-Laminat definierter Brennbarkeit, kupferkaschiert
CommitteeEPL/501
ISBN0 580 32519 9
PublisherBSI
FormatA4
DeliveryYes
Pages20
File Size384 KB
Price£130.00


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