BS 4584-10:1977 - Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10

BS 4584-10:1977

Specification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10

Status : Withdrawn   Published : November 1977

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General purpose grade and material of defined flammability.




Standard NumberBS 4584-10:1977
TitleSpecification for metal-clad base materials for printed circuits. Flexible copper-clad polyimide film: PI-F-Cu-10
StatusWithdrawn
Publication Date30 November 1977
Withdrawn Date28 June 1991
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
DescriptorsThickness, Flexible materials, Adhesive strength, Tensile testing, Permittivity, Laminates, Fire tests, Fatigue, Bend testing, Weight measurement, Elongation at fracture, Density measurement, Surface properties, Defects, Polymers, Coated materials, Printed circuits, Dimensions, Foil, Marking, Dimensional tolerances, Soldering, Electronic equipment and components, Dielectric strength, Films (states of matter), Electrical resistivity, Metal coatings, Dissipation factor, Packaging, Flammability, Weight (mass), Printed-circuit bases, Test equipment, Adhesion tests, Dimensional measurement, Copper, Thickness measurement, Fatigue testing, Electrical resistance, Mechanical testing, Dimensional changes, Density, Printed-circuit boards, Tensile strength
ICS31.180
Title in FrenchSpécification des matériaux de base à couverture métallique pour les circuits imprimés. Film flexible de polyimide à couverture de cuivre: PI-F-Cu-10
Title in GermanSpezifikation fuer metallbekleidete Grundwerkstoffe fuer gedruckte Schaltungen. Flexible verkupferte Polyimidfilm: PI-F-Cu-10
ISBN0 580 09557 6
PublisherBSI
FormatA4
DeliveryNo
Pages16
File Size1.076 MB
Price£130.00


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