BS CECC 23800-801:1998 - Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

BS CECC 23800-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

Status : Current   Published : June 1998

Format
PDF

Format
HARDCOPY






Standard NumberBS CECC 23800-801:1998
TitleHarmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
StatusCurrent
Publication Date15 June 1998
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsCECC 23800-801:1998
DescriptorsPrinted-circuit boards, Printed circuits, Electronic equipment and components, Electrical equipment, Electrical components, Assessed quality, Quality assurance systems, Capability approval, Approval testing, Detail specification, Specification (approval), Finishes, Surface treatment, Metal coatings, Organic coatings, Designations, Inspection, Defects, Dimensional measurement, Visual inspection (testing), Bonding, Thickness, Electrical testing, Resistance measurement, Electrical insulation, Contaminants, Mechanical testing, Porosity measurement, Solderability testing, Conformity, Ageing tests, Specimen preparation, Edge socket connectors, Holes, Preferred sizes
ICS31.180
Title in FrenchSpecification particuliere d'Agrement: cartes imprimees multicouches souples avec connexions transversales
Title in GermanBauartspezifikation zur Anerkennung der Befaehigung: flexible Mehrlagen-Leiterplatten mit Durchverbindungen
CommitteeEPL/501
ISBN0 580 29889 2
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size416 KB
Price£182.00


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