BS CECC 23200-003:1996 - Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes

BS CECC 23200-003:1996

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes

Status : Current   Published : April 1996

Format
PDF

Format
HARDCOPY






Standard NumberBS CECC 23200-003:1996
TitleHarmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
StatusCurrent
Publication Date15 April 1996
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsCECC 23200-003
Amended ByAMD 9806
Draft Superseded By96/216188 DC
DescriptorsElectronic equipment and components, Printed circuits, Printed-circuit boards, Holes, Quality assurance systems, Approval testing, Capability approval, Testing conditions, Electrical testing, Surface defects, Test specimens, Performance, Inspection, Specification (approval), Assessed quality, Metal coatings, Thickness, Organic coatings, Adhesion tests, Porosity measurement, Stain tests, Solvent-resistance tests, Test equipment
ICS31.180
Title in FrenchSysteme harmonise d'evaluation de la qualite des composants electroniques. Specification detaillee d'aptitude: cartes imprimees simple face et double face avec trous graves
Title in GermanHarmonisiertes Guetebestaetigungssystem fuer Bauelemente der Elektronik. Bauartspezifikation zur Anerkennung der Befaehigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Loechern
CommitteeEPL/501
ISBN0 580 25422 4
PublisherBSI
FormatA4
DeliveryYes
Pages30
File Size935.6 KB
Price£182.00


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