BS 3934-5:1997, IEC 60191-5:1997 - Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

BS 3934-5:1997, IEC 60191-5:1997

Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

Status : Current   Published : September 1997

Format
PDF

Format
HARDCOPY



Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).




Standard NumberBS 3934-5:1997, IEC 60191-5:1997
TitleMechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
StatusCurrent
Publication Date15 September 1997
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS 3934-5:1992, IEC 60191-5:1987
International RelationshipsIEC 60191-5:1997
Draft Superseded By93/216730 DC
DescriptorsMechanical behaviour of materials, Mechanical properties of materials, Standardization, Electronic equipment and components, Semiconductor devices, Integrated circuits, Flexible materials, Tape, Films (states of matter), Dimensions, Perforations, Electrical connections, Holes, Bonding, Codes, Datum, Dimensional tolerances
ICS31.080.01
Title in FrenchNormalisation mecanique des dispositifs a semiconducteurs. Recommandations applicables aux boitiers a transfert automatise sur bande (TAB) des circuits integres
Title in GermanMechnische Normung von Halbleiterbauelementen. Empfehlungen zum automatischen Filmbonden (TAB) von integrierten Schaltungen
CommitteeEH/3
ISBN0 580 27812 3
PublisherBSI
FormatA4
DeliveryYes
Pages38
File Size876.5 KB
Price£214.00


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