BS 5664-3.11:1995, IEC 60455-3-11:1988 - Solventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials. Epoxy resin-based coating powders

BS 5664-3.11:1995, IEC 60455-3-11:1988

Solventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials. Epoxy resin-based coating powders

Status : Current   Published : September 1995

Format
PDF

Format
HARDCOPY



Specifies requirements for coating powders being applied by such processes as fluidized air bed, powder spraying and electrostatic coating.




Standard NumberBS 5664-3.11:1995, IEC 60455-3-11:1988
TitleSolventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials. Epoxy resin-based coating powders
StatusCurrent
Publication Date15 September 1995
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 60455-3-11:1988
DescriptorsPlastics, Insulating coatings, Epoxy resins, Electrical insulating materials, Solid electrical insulating materials, Thermosetting polymers, Coatings, Designations, Breakdown voltage, Plastic coatings, Particulate materials, Specimen preparation, Test specimens, Thermal testing, Endurance testing, Thickness measurement
ICS29.035.20
Title in FrenchSpecification relative aux composes resineux polymerisables sans solvant utilises comme isolants electriques. Specifications pour les materiaux particuliers. Poudres de revetement a base de resines epoxydes
Title in GermanVorschrift fuer loesungsmittelfreie polymerisierbare harzartige Kompounds, die zur elektrischen Isolation verwendet werden. Vorschriften fuer einzelne Werkstoffe. Pulverlack auf Epoxydharzbasis
CommitteeGEL/15
ISBN0 580 24427 X
PublisherBSI
FormatA4
DeliveryYes
Pages10
File Size246.6 KB
Price£110.00


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