BS 6221-12:1992, IEC 60326-12:1992 - Printed wiring boards. Specification for mass lamination panels (semi-manufactured multilayer printed boards)

BS 6221-12:1992, IEC 60326-12:1992

Printed wiring boards. Specification for mass lamination panels (semi-manufactured multilayer printed boards)

Status : Withdrawn   Published : November 1992

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Characteristics of mass lamination panels, irrespective of method of manufacture. Intended as a basis for agreements between purchaser and vendor.




Standard NumberBS 6221-12:1992, IEC 60326-12:1992
TitlePrinted wiring boards. Specification for mass lamination panels (semi-manufactured multilayer printed boards)
StatusWithdrawn
Publication Date15 November 1992
Withdrawn Date24 April 2012
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 60326-12:1992
Draft Superseded By89/29689 DC
DescriptorsPrinted-circuit boards, Printed circuits, Electronic equipment and components, Printed wiring, Laminates, Position, Panels, Dimensional tolerances, Marking, Detail specification, Packaging
ICS31.180
Title in FrenchCartes imprimees. Specification pour panneaux "mass-lam" (cartes imprimees multicouches semi-finies)
Title in GermanLeiterplatten. Anforderungen an Masslaminat-Nutzen (Mehrlagen-Leiterplatten-Halbfabrikat)
CommitteeEPL/501
ISBN0 580 21328 5
PublisherBSI
FormatA4
DeliveryNo
Pages16
File Size488.8 KB
NotesThis standard has been withdrawn as BS 6221-12:1992 is identical to IEC 60326-12:1992, which has been withdrawn by IEC/TC 91
Price£130.00


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*To ask about withdrawn titles contact the
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