BS EN 60249-2-13:1994, IEC 60249-2-13:1987 - Base material for printed circuits. Specifications. Flexible copper-clad polyimide film, general purpose grade

BS EN 60249-2-13:1994, IEC 60249-2-13:1987

Base material for printed circuits. Specifications. Flexible copper-clad polyimide film, general purpose grade

Status : Withdrawn   Published : February 1990

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Standard NumberBS EN 60249-2-13:1994, IEC 60249-2-13:1987
TitleBase material for printed circuits. Specifications. Flexible copper-clad polyimide film, general purpose grade
StatusWithdrawn
Publication Date28 February 1990
Withdrawn Date01 October 2006
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60249-2-13:1994,IEC 60249-2-13:1987
Amended ByAMD 8421
Draft Superseded By89/22208 DC
DescriptorsPrinted-circuit bases, Printed-circuit boards, Printed circuits, Coated materials, Metal coatings, Copper, Films (states of matter), Polymers, Flexible materials, Grades (quality), Thickness, Marking, Electrical resistance, Electrical resistivity, Permittivity, Dissipation factor, Dielectric strength, Surface defects, Dimensional tolerances, Adhesive strength, Wettability, Dimensional changes, Fatigue, Bending, Rolls, Polyimides
ICS31.180
Title in FrenchMatériaux de base pour circuits imprimés Spécifications. Film flexible de polyimide recouvert de cuivre, de qualité courante
Title in GermanBasismaterialien fuer gedruckte Shaltungen Einzelbestimmungen. Flexible kupferkaschierte Polyimidfolie fuer allgemeine Anwendungszwecke
CommitteeEPL/501
ISBN0 580 18186 3
PublisherBSI
FormatA4
DeliveryNo
Pages18
File Size393.2 KB
NotesThis standard has been withdrawn as the corresponding European standard has now been withdrawn by CENELEC.
Price£130.00


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