BS EN IEC 61190-1-3:2018 - Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Status : Current   Published : March 2018

Format
PDF

Format
HARDCOPY



IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.


This edition includes the following significant technical changes with respect to the previous edition:


a)   The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.





Standard NumberBS EN IEC 61190-1-3:2018
TitleAttachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
StatusCurrent
Publication Date28 March 2018
Normative References(Required to achieve compliance to this standard)IEC 61189-5-3:2015, IEC 61189-5-2:2015, IEC 61190-1-1:2002, EN 61190-1-1 (IEC 61190-1-1:2002 AS), IEC 60194:2015, EN 61189-5-4:2015, IEC 61189-5-4:2015, EN 61189-5-2:2015, IEC 61190-1-2, EN 61190-1-2, EN 61189-5-3:2015
Informative References(Provided for Information)IEC 61189-5, EN ISO 9453, ISO 9454-2, IEC 61189-6, EN 61189-5, EN 61189-6, ISO 9453, EN ISO 9454-1, ISO 9454-1, EN ISO 9454-2, ISO 1073-1
ReplacesBS EN 61190-1-3:2007+A1:2010
International RelationshipsEN 60076-1:2011,EN IEC 61190-1-3:2018,IEC 61190-1-3:2017
Draft Superseded By15/30318681 DC
DescriptorsElectronic equipment and components, Electronic engineering, Quality control, Bars (materials), Classification systems, Soldering, Fluxes (materials), Particulate materials, Bonding, Quality assurance, Test methods, Pastes, Electrical connections, Solders
ICS31.190
Title in FrenchMatériaux de fixation pour les assemblages électroniques Exigences relatives aux alliages à braser de catégorie électronique et brasure solide fluxée et non-fluxée pour les applications de brasage électronique
Title in GermanVerbindungsmaterialien für Baugruppen der Elektronik Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
CommitteeEPL/501
ISBN978 0 580 89238 7
PublisherBSI
FormatA4
DeliveryYes
Pages50
File Size1.321 MB
Price£240.00


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