14/30297227 DC - BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method

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14/30297227 DC

BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method

Status : Current, Draft for public comment   Published : January 2014

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Standard Number14/30297227 DC
TitleBS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method
StatusCurrent, Draft for public comment
Publication Date28 January 2014
International RelationshipsIEC Document 47/2191/CD
Draft Expiry Date20 March 2014
DescriptorsElectromechanical devices, Electronic equipment and components, Integrated circuits, Semiconductor devices, Terminology, Semiconductor technology, Vocabulary, Terminology, Semiconductor devices, Electronic equipment and components, Semiconductor technology, Integrated circuits, Electromechanical devices, Vocabulary
ICS31.080.99
CommitteeEPL/47
PublisherBSI
FormatA4
DeliveryYes
Pages33
File Size913 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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