BS EN 60191-6:2009 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages

BS EN 60191-6:2009

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Status : Current   Published : April 2010

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IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:


a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;


b) editorial modifications on several pages; and


c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.




Standard NumberBS EN 60191-6:2009
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
StatusCurrent
Publication Date30 April 2010
Normative References(Required to achieve compliance to this standard)EN 60191-4:1999/AMD 2:2002, ISO 1101:2004, EN 60191-4:1999/AMD 1:2002, EN 60191-1:2007, EN 60191-4:1999, IEC 60191-4:2002, IEC 60191-4:1999/AMD 2:2002, IEC 60191-4:1999, IEC 60191-4:1999/AMD 1:2001, EN ISO 1101:2005, IEC 60191-1:2007
Informative References(Provided for Information)IEC 60191-3, ISO 2692, IEC 60191-2
ReplacesBS EN 60191-6:2004
International RelationshipsEN 60191-6:2009,EN 61755-2-2:2006,IEC 60191-6:2009
Draft Superseded By07/30167960 DC
DescriptorsSemiconductor devices, Drawings, Shape, Surface mounting devices, Electronic equipment and components, Dimensions, Standardization, Engineering drawings, Integrated circuits, Interchangeability, Technical drawing, Packages
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semi-conducteurs. Règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semi-conducteurs pour montage en surface
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen
CommitteeEPL/47
ISBN978 0 580 59338 3
PublisherBSI
FormatA4
DeliveryYes
Pages42
File Size490 KB
Price£214.00


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