BS EN 60749-21:2005 - Semiconductor devices. Mechanical and climatic test methods. Solderability

BS EN 60749-21:2005

Semiconductor devices. Mechanical and climatic test methods. Solderability

Status : Revised, Withdrawn   Published : December 2005 Replaced By : BS EN 60749-21:2011

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Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.




Standard NumberBS EN 60749-21:2005
TitleSemiconductor devices. Mechanical and climatic test methods. Solderability
StatusRevised, Withdrawn
Publication Date05 December 2005
Withdrawn Date31 August 2011
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60749-20:2002, IEC 60068, IEC 60749-15:2003, IEC 60749
Replaced ByBS EN 60749-21:2011
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsIEC 60749-21:2004,EN 60749-21 (IEC 60749-21:2004
Draft Superseded By01/208640 DC
DescriptorsElectronic equipment and components, Thermal testing, Environmental testing, Integrated circuits, Mechanical testing, Soldering, Semiconductor devices, Solderability testing
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Brasabilite
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Loetbarkeit
CommitteeEPL/47
ISBN0 580 46191 2
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size1.127 MB
Price£182.00


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